TMP35/TMP36/TMP37

Rev. F | Page 2 of 20

TABLE OF CONTENTS

Features .............................................................................................. 1

 

Applications....................................................................................... 1

 

General Description ......................................................................... 1

 

Functional Block Diagram .............................................................. 1

 

Pin Configurations ........................................................................... 1

 

Revision History ............................................................................... 2

 

Specifications..................................................................................... 3

 

Absolute Maximum Ratings............................................................ 4

 

Thermal Resistance ...................................................................... 4

 

ESD Caution.................................................................................. 4

 

Typical Performance Characteristics ............................................. 5

 

Functional Description .................................................................... 8

 

Applications Information ................................................................ 9

 

Shutdown Operation.................................................................... 9

 

Mounting Considerations ........................................................... 9

 

Thermal Environment Effects .................................................... 9

 

Basic Temperature Sensor Connections.................................. 10

 

Fahrenheit Thermometers ........................................................ 10

 

Average and Differential Temperature Measurement ........... 12

 

Microprocessor Interrupt Generator....................................... 13

 

Thermocouple Signal Conditioning with Cold-Junction

Compensation............................................................................. 14

 

Using TMP3x Sensors in Remote Locations .......................... 15

 

Temperature to 4–20 mA Loop Transmitter .......................... 15

 

Temperature-to-Frequency Converter .................................... 16

 

Driving Long Cables or Heavy Capacitive Loads .................. 17

 

Commentary on Long-Term Stability ..................................... 17

 

Outline Dimensions ....................................................................... 18

 

Ordering Guide .......................................................................... 19

 

Automotive Products ................................................................. 20

 

REVISION HISTORY

11/10—Rev. E to Rev. F

Changes to Features.......................................................................... 1

Updated Outline Dimensions ....................................................... 18

Changes to Ordering Guide .......................................................... 19

Added Automotive Products Section .......................................... 20

8/08—Rev. D to Rev. E

Updated Outline Dimensions ....................................................... 18

Changes to Ordering Guide .......................................................... 19

3/05—Rev. C to Rev. D

Updated Format..................................................................Universal

Changes to Specifications ................................................................ 3

Additions to Absolute Maximum Ratings..................................... 4

Updated Outline Dimensions ....................................................... 18

Changes to Ordering Guide .......................................................... 19

10/02—Rev. B to Rev. C

Changes to Specifications.................................................................3

Deleted Text from Commentary on Long-Term Stability

Section.............................................................................................. 13

Updated Outline Dimensions....................................................... 14

9/01—Rev. A to Rev. B

Edits to Specifications .......................................................................2

Addition of New Figure 1 .................................................................2

Deletion of Wafer Test Limits Section ............................................3

6/97—Rev. 0 to Rev. A

3/96—Revision 0: Initial Version