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AOZ8000CIL 数据表(PDF) 7 Page - Alpha & Omega Semiconductors |
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AOZ8000CIL 数据表(HTML) 7 Page - Alpha & Omega Semiconductors |
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7 / 15 page ![]() AOZ8000 Rev. 2.4 July 2010 www.aosmd.com Page 7 of 15 Package Dimensions, SC70-6L e1 D E1 E A A2 A1 b c L e θ 0.15mm 0.65 0.35 1.95 0.65 .010mm Gauge Plane Notes: 1. All dimensions are in millimeters. 2. Dimensions are inclusive of plating 3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 3 mils. 4. Die is facing up for mold and facing down for trim/form; i.e., reverse trim/form. 5. Dimension L is measured in gauge plane. 6. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. Symbols A A1 A2 b c D E e e1 E1 L θ Dimensions in millimeters Min. 0.00 0.7 0.15 0.08 1.85 1.80 1.1 0.26 0 ° Nom. — — 0.9 — — 2.10 2.30 0.65 BSC 1.30 BSC 1.30 0.36 4 ° Max. 1.10 0.10 1.00 0.30 0.22 2.15 2.40 1.4 0.46 8 ° Symbols A A1 A2 b c D E e e1 E1 L θ Dimensions in inches Min. 0.00 0.028 0.006 0.003 0.073 0.071 0.043 0.010 0 ° Nom. — — 0.035 — — 0.083 0.091 0.026 BSC 0.051 BSC 0.051 0.014 4 ° Max. 0.043 0.004 0.039 0.012 0.009 0.085 0.094 0.055 0.018 8 ° UNIT: mm RECOMMENDED LAND PATTERN |
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