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MMZ2012 数据表(PDF) 2 Page - TDK Electronics

部件名 MMZ2012
功能描述  Chip Beads For signal line MMZ series
PDF  29 Pages
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制造商  TDK [TDK Electronics]
网页  http://www.tdk.com
标志 TDK - TDK Electronics

MMZ2012 数据表(HTML) 2 Page - TDK Electronics

  MMZ2012 Datasheet HTML 1Page - TDK Electronics MMZ2012 Datasheet HTML 2Page - TDK Electronics MMZ2012 Datasheet HTML 3Page - TDK Electronics MMZ2012 Datasheet HTML 4Page - TDK Electronics MMZ2012 Datasheet HTML 5Page - TDK Electronics MMZ2012 Datasheet HTML 6Page - TDK Electronics MMZ2012 Datasheet HTML 7Page - TDK Electronics MMZ2012 Datasheet HTML 8Page - TDK Electronics MMZ2012 Datasheet HTML 9Page - TDK Electronics Next Button
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• All specifications are subject to change without notice.
(1/28)
002-01 / 20130301 / e9412_mmz
Chip Beads
For Signal Line
MMZ Series MMZ0402
FEATURES
• It is super small size(L0.4
W0.2T0.2mm).
• It prevents radiated noise from high-speed signal lines.
• Maintain impedance to high frequency band.
• Because it adopts silver in internal electrode, it is low DC
resistance.
• Because it is not generate of cross talk with closed magnetic cir-
cuit structural design, high density assembly is possible.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, portable audio
players, various modules, etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L
W
(3) Type name
(4) Impedance
121:120
 at 100MHz
(5) Characteristic type
(6) Packaging style
T: Taping
(7) TDK internal code
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
SPECIFICATIONS
PACKAGING STYLE AND QUANTITIES
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
ELECTRICAL CHARACTERISTICS
Test equipment: E4991A or equivalent
Test tool
: 16197 or equivalent
Test temperature: 25±10°C
Conformity to RoHS Directive
MMZ 0402
S 121 C
T
(1)
(2)
(3) (4) (5) (6)
(7)
Operating temperature range
–55 to +125°C
Storage temperature range
–55 to +125°C(After mount)
Packaging style
Quantity
Taping
20000 pieces/reel
Part No.
Impedance
(
)[100MHz]
DC resistance
(
)max.
Rated current
(mA)max.
MMZ0402S100C
10±5
0.10
500
MMZ0402S700C
70±25%
0.45
260
MMZ0402S121C
120±25%
0.70
210
MMZ0402S151C
150±25%
0.70
200
0.4
±0.02
0.08 to 0.14
Weight: 0.08mg
Dimensions in mm
0.2
0.15 to 0.2
0.15 to 0.2
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.



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