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MMZ2012 数据表(PDF) 25 Page - TDK Electronics

部件名 MMZ2012
功能描述  Chip Beads For signal line MMZ series
PDF  29 Pages
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制造商  TDK [TDK Electronics]
网页  http://www.tdk.com
标志 TDK - TDK Electronics

MMZ2012 数据表(HTML) 25 Page - TDK Electronics

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• All specifications are subject to change without notice.
(24/28)
002-01 / 20130301 / e9412_mmz
Chip Beads
For Signal Line
MMZ Series MMZ0603-E
FEATURES
• This is a multilayered chip bead product with dimensions of
L0.6
W0.3T0.3mm.
• Compared with the existing MMZ0603 type, this new product
has broad-band impedance values for higher frequency ranges.
• The product is magnetically shielded, allowing high density
mounting.
• We refined the rules for internal conductor design to reduce
floating capacity between conductors, which in turn has
contributed to a dramatic improvement in high frequency
characteristics. We have also been able to expand and reinforce
the EMI suppression in the GHz range.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, portable audio
players, various modules, DSCs, portable game machines, etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L
W
(3) Type name
(4) Impedance
102:1000
 at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
(7) TDK internal code
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
SPECIFICATIONS
PACKAGING STYLE AND QUANTITIES
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
ELECTRICAL CHARACTERISTICS
Test equipment: E4991A or equivalent
Test tool
: 16197 or equivalent
Test temperature: 25±10°C
Conformity to RoHS Directive
MMZ 0603
S 102 E
T
(1)
(2)
(3) (4) (5) (6)
(7)
Operating temperature range
–55 to +125°C
Storage temperature range
–55 to +125°C(After mount)
Packaging style
Quantity
Taping
15000 pieces/reel
Part No.
Impedance(
)
DC resistance
(
)max.
Rated current
(mA)max.
[100MHz]
[1GHz]
MMZ0603S601E
600±25%
1000±40%
1.60
150
MMZ0603S102E
1000±25% 1800±40%
2.60
125
0.6
±0.03
0.1min.
Weight: 0.3mg
Dimensions in mm
0.30
0.25
0.25
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.



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