Characteristics

P010xx

4/11

Table 6.

Thermal resistance

Symbol

Parameter

Maximum

Unit

Junction to case (DC)

TO-92

80

°C/W

Junction to tab (DC)

SOT-223

30

°C/W

Junction to ambient (DC)

TO-92

150

°C/W

SOT-223

60

Junction to ambient (mounted on FR4 with recommended pad layout) SOT23-3L

400

°C/W

1.

S = Copper surface under tab.

Figure 1.

Maximum average power

dissipation vs. average on-state

current P010xxA and P010xxN

Figure 2.

Maximum average power

dissipation vs. average on-state

current P010xxL

0.00.1

0.2

0.30.4

0.50.6

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

P(W)

α = 180°

360°

α

I

(A)

T(AV)

0.00

0.02

0.04

0.06

0.08

0.10

0.12

0.14

0.16

0.18

0.00

0.02

0.04

0.06

0.08

0.10

0.12

0.14

0.16

0.18

0.20

0.22

0.24

0.26

0.28

0.30

P(W)

I

(A)

T(AV)

α = 180°

360°

α

Figure 3.

Average and DC on-state current

vs. lead temperature

P010xxA and P010xxN

Figure 4.

Average and DC on-state current

vs. ambient temperature P010xxA

and P010xxN

0

25

50

75

100

125

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

I

(A)

T(AV)

T

(°C)

lead

α = 180° (SOT-223)

α = 180° (TO-92)

D.C. (SOT-223)

D.C. (TO-92)

0

25

50

75

100

125

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

I

(A)

T(AV)

T

(°C)

amb

α = 180° (SOT-223)

α = 180° (TO-92)

D.C. (SOT-223)

D.C. (TO-92)

Device mounted on

FR4 with recomended

pad layout for SOT-223