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OMAP3530ECBC 数据表(PDF) 129 Page - Texas Instruments |
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OMAP3530ECBC 数据表(HTML) 129 Page - Texas Instruments |
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129 / 264 page  SRAM_LDO1 cap_vdd_sram_mpu_ iva SRAM_LDO2 cap_vdd_sram_core BG WKUP_LDO vdds_wkup_bg DPLL_MPU DPLL_IVA DPLL_CORE vdds_dpll_dll vdds_sram DPLL5 DPLL4 vdds_dpll_per Video DAC vdda_dac MMC IOs vdds_mmc1 OMAP Device VSS vssa_dac Cvdds_sram Ccap_vdd_sram_mpu_iva Ccap _vdd_sram_core Cvdds_wkup_bg Cvdds_dpll_dll Cvdds_dpll_per Cvdda_dac Cvdds_mmc1 vdda_dac vdds_mmc1 vdds_sram vdds_wkup_bg vdds_dpll_per vdds_dpll_dll Ccap_vdd_wkup cap_vdd_wkup MPU Vdd_mpu_iva Cvdd_mpu_iva vdd_mpu_iva Core vdd_core Cvdd_core Vdd_core 030-004 vdds_mmc1a vdds_mmc1a Cvdds_mmc1a Video DAC DSS cap_vdd_d cap_vdd_d Ccap_vdd_d I/Os and Memory vdds vdds_mem Cvdds_mem Cvdds OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 illustrates an example of power supply decoupling. A. On the CBC package, signals "vdds" and "vdds_mem" are combined with "vdds". B. Signals "vdds" and "vdds_mem" are separate on the CBB and CUS packages. Figure 3-2. Power Supply Decoupling Submit Documentation Feedback ELECTRICAL CHARACTERISTICS 129 |
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