DocID18203 Rev 8

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M95M02-DR

Description

Figure 2. 8-pin package connections (top view)

1. See Section 10: Package mechanical data section for package dimensions, and how to identify pin 1.

Figure 3. WLCSP connections (bump side view)

1. Preliminary data.

2. See Section 10: Package mechanical data for package dimensions, and how to identify pin-1.

Caution:

As EEPROM cells lose their charge (and so their binary value) when exposed to ultra violet

(UV) light, EEPROM dice delivered in wafer form or in WLCSP package by

STMicroelectronics must never be exposed to UV light.

D

VSS

C

HOLD

Q

SVCC

W

AI01790D

M95xxx

1

2

3

4

8

7

6

5

MS30973V1

S

Q

W

VSS

D

C

VCC

W

HOLD