PCF8574TSSLASH3 datasheet(33/33 Pages) NXP

33 / 33 page

NXP Semiconductors

PCF8574; PCF8574A

Remote 8-bit I/O expander for I2C-bus with interrupt

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 27 May 2013

Document identifier: PCF8574_PCF8574A

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

24. Contents

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

4.1

Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Pinning information . . . . . . . . . . . . . . . . . . . . . . 4

6.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

Functional description . . . . . . . . . . . . . . . . . . . 5

7.1

Device address . . . . . . . . . . . . . . . . . . . . . . . . . 5

7.1.1

Address maps. . . . . . . . . . . . . . . . . . . . . . . . . . 5

I/O programming . . . . . . . . . . . . . . . . . . . . . . . . 6

8.1

Quasi-bidirectional I/Os . . . . . . . . . . . . . . . . . . 6

8.2

Writing to the port (Output mode) . . . . . . . . . . . 8

8.3

Reading from a port (Input mode) . . . . . . . . . . 9

8.4

Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 9

8.5

Interrupt output (INT) . . . . . . . . . . . . . . . . . . . 10

Characteristics of the I2C-bus . . . . . . . . . . . . 11

9.1

Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

9.1.1

START and STOP conditions . . . . . . . . . . . . . 11

9.2

System configuration . . . . . . . . . . . . . . . . . . . 11

9.3

Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 12

Application design-in information . . . . . . . . . 13

10.1

Bidirectional I/O expander applications . . . . . 13

10.2

How to read and write to I/O expander

(example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

10.3

High current-drive load applications . . . . . . . . 14

10.4

Migration path . . . . . . . . . . . . . . . . . . . . . . . . . 14

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15

Thermal characteristics . . . . . . . . . . . . . . . . . 15

Static characteristics . . . . . . . . . . . . . . . . . . . . 16

Dynamic characteristics . . . . . . . . . . . . . . . . . 17

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19

Handling information. . . . . . . . . . . . . . . . . . . . 22

Soldering of SMD packages . . . . . . . . . . . . . . 22

17.1

Introduction to soldering . . . . . . . . . . . . . . . . . 22

17.2

Wave and reflow soldering . . . . . . . . . . . . . . . 22

17.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22

17.4

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 23

Soldering of through-hole mount packages . 24

18.1

Introduction to soldering through-hole mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

18.2

Soldering by dipping or by solder wave . . . . . 24

18.3

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 24

18.4

Package related soldering information. . . . . . 25

Soldering: PCB footprints . . . . . . . . . . . . . . . 26

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 28

Revision history . . . . . . . . . . . . . . . . . . . . . . . 29

Legal information . . . . . . . . . . . . . . . . . . . . . . 31

22.1

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 31

22.2

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

22.3

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 31

22.4

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Contact information . . . . . . . . . . . . . . . . . . . . 32

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

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