REV. D

AD8002

–3–

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2 V

Internal Power Dissipation

2

Plastic DIP Package (N) . . . . . . . . . . . . . . . . . . . . . . . 1.3 W

Small Outline Package (R) . . . . . . . . . . . . . . . . . . . . . . 0.9 W

µSOIC Package (RM) . . . . . . . . . . . . . . . . . . . . . . . . . 0.6 W

Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . .

Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . .

±1.2 V

Output Short Circuit Duration

. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves

Storage Temperature Range N, R, RM . . . . . –65

°C to +125°C

Operating Temperature Range (A Grade) . . . – 40

°C to +85°C

Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

8-Lead Plastic DIP Package:

θ

°C/W

8-Lead SOIC Package:

θ

°C/W

8-Lead

µSOIC Package: θ

°C/W

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the

AD8002 is limited by the associated rise in junction tempera-

ture. The maximum safe junction temperature for plastic

encapsulated devices is determined by the glass transition tem-

perature of the plastic, approximately 150

°C. Exceeding this

limit temporarily may cause a shift in parametric performance

due to a change in the stresses exerted on the die by the package.

Exceeding a junction temperature of 175

°C for an extended

period can result in device failure.

While the AD8002 is internally short circuit protected, this

may not be sufficient to guarantee that the maximum junction

temperature (150

°C) is not exceeded under all conditions. To

ensure proper operation, it is necessary to observe the maximum

power derating curves.

2.0

0

–50

80

1.5

0.5

–40

1.0

010

–10

–20

–30

20

30

40

50

60

70

90

AMBIENT TEMPERATURE – C

8-LEAD PLASTIC-DIP PACKAGE

8-LEAD SOIC PACKAGE

8-LEAD

SOIC

PACKAGE

Figure 3. Plot of Maximum Power Dissipation vs.

Temperature

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD8002 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Brand Code

AD8002AN

–40

°C to +85°C

8-Lead PDIP

N-8

Standard

AD8002AR

–40

°C to +85°C

8-Lead SOIC

SO-8

Standard

AD8002AR-REEL

–40

°C to +85°C

8-Lead SOIC 13" REEL

SO-8

Standard

AD8002AR-REEL7

–40

°C to +85°C

8-Lead SOIC 7" REEL

SO-8

Standard

AD8002ARM

–40

°C to +85°C

8-Lead

µSOIC

RM-8

HFA

AD8002ARM-REEL

–40

°C to +85°C

8-Lead

µSOIC 13" REEL

RM-8

HFA

AD8002ARM-REEL7

–40

°C to +85°C

8-Lead

µSOIC 7" REEL

RM-8

HFA

WARNING!

ESD SENSITIVE DEVICE