ADuCM360/ADuCM361

Data Sheet

Rev. B | Page 22 of 24

TYPICAL SYSTEM CONFIGURATION

Figure 15 shows a typical ADuCM360/ADuCM361 configuration. This figure illustrates some of the hardware considerations. The bottom

of the LFCSP package has an exposed pad that must be soldered to a metal plate on the PCB for mechanical reasons and to DGND. The

metal plate of the PCB can be connected to ground. The 0.47 µF capacitor on the AVDD_REG and DVDD_REG pins should be placed

as close to the pins as possible. In noisy environments, an additional 1 nF capacitor can be added to IOVDD and AVDD.

1

2

3

P0.7/POR/SOUT

P0.6/IRQ2/SIN

P0.5/CTS/IRQ1

4

P0.4/RTS/ECLKO

5

P0.3/IRQ0/CS1

6

P0.2/MOSI1/SDA/SOUT

7

P0.1/SCLK1/SCL/SIN

24

23

22

21

20

19

18

17

16

AGND

12pF

12pF

15

VREF–

14

VREF+

13

GND_SW

44

45

46

47

48

43

42

41

40

P1.2/PWM0/RI

39

P1.1/IRQ4/PWMTRIP/DTR

38

P1.0/IRQ3/PWMSYNC/EXTCLK

37

IOVDD

ADuCM360

25

AIN4/IEXC

26

AIN3

27

AIN2

28

AIN1

29

AIN0

30

DVDD_REG

DVDD

DGND

31

IOVDD

32

XTALI

33

XTALO

34

P2.2/BM

35

P2.1/SDA/UARTDCD

36

RESET

RESET

RESET

RESET

8

P0.0/MISO1

9

AIN11/VBIAS1

10

AIN10

11

AIN9/DACBUFF+

12

AIN8/EXTREF2IN–

0.47µF

0.47µF

0.1µF

150kΩ

GND

DGND

SWIO

TX

SWCLK

RX

5V USB

SWDIO

SWCLK

DVDD

DGND

DGND

0.1µF

AVDD

0.47µF

0.1µF

0.1µF

1µF

0.1µF

560Ω

1.6Ω

IN

OUT

EN

GND

DGND

DGND

DGND

AVDD

DVDD

AGND

AGND AGND

4.7µF

4.7µF

ADP1720ARMZ-3.3

Figure 15. Typical System Configuration