ADP190/ADP191

Rev. D | Page 15 of 16

OUTLINE DIMENSIONS

0.050 NOM

COPLANARITY

0.800

0.760 SQ

0.720

0.230

0.200

0.170

0.280

0.260

0.240

0.660

0.600

0.540

0.430

0.400

0.370

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

A

1

2

B

SEATING

PLANE

0.40

BALL PITCH

BALL A1

IDENTIFIER

Figure 39. 4-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-4-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Branding

ADP190ACBZ-R7

−40°C to +85°C

4-Ball Wafer Level Chip Scale Package [WLCSP]

CB-4-3

4D

ADP191ACBZ-R7

−40°C to +85°C

4-Ball Wafer Level Chip Scale Package [WLCSP]

CB-4-3

4G

ADP190CB-EVALZ

Evaluation Board

ADP191CB-EVALZ

Evaluation Board