2

IR3837MPbF

Rev 1.31

Package Information

5mm x 6mm Power QFN

(Top View)

13

PVin

12

SW

11

PGnd

17

Gnd

1

23

4

5

6

7

8

9

16

15

Fb Vref Comp Gnd

Rt OCset PGood

Sync

Vin

Vp

Boot

ABSOLUTE MAXIMUM RATINGS

(Voltages referenced to GND unless otherwise specified)

•

PVin, Vin ……………………………………………… -0.3V to 25V

•

Vcc/LDO_out ……………….……..……..……….…… -0.3V to 8V (Note2)

•

Boot

……………………………………..……….….. -0.3V to 33V

•

SW

…………………………………………..……… -0.3V to 25V (DC), -4V to 25V (AC, 100ns)

•

Boot to SW

……..…………………………… …..…. -0.3V to Vcc+0.3V (Note1)

•

OCset

…………………………………………..…… -0.3V to 30V

•

Input / output Pins ………………………………... ... -0.3V to Vcc+0.3V (Note1)

•

PGnd to Gnd ……………...………………….…….…. -0.3V to +0.3V

•

Storage Temperature Range .................................... -55°C To 150°C

•

Junction Temperature Range ................................... -40°C To 150°C (Note2)

•

ESD Classification …………………………… ……… JEDEC(2KV)

•

Moisture sensitivity level………………...……………. JEDEC Level 2 @260 °C (Note 5)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. These are stress ratings only and functional operation of the device at these or any other conditions

beyond those indicated in the operational sections of the specifications are not implied.

Note1:

Must not exceed 8V

Note2:

Enable

Vcc/LDO_out

10

14

W

/

C

2

θ

W

/

C

35

θ

o

PCB

J

o

JA

=

=

-

4000

17

IR3837MTRPbF

M

750

PARTS PER

REEL

17

PIN

COUNT

IR3837MTR1PbF

PACKAGE

DESCRIPTION

M

PACKAGE

DESIGNATOR

ORDERING INFORMATION