35

IR3837MPbF

Rev 1.31

Stencil Design

Stencils for PQFN can be used with thicknesses of 0.100-0.250mm (0.004-0.010"). Stencils thinner

than 0.100mm are unsuitable because they deposit insufficient solder paste to make good solder

joints with the ground pad; high reductions sometimes create similar problems. Stencils in the

range of 0.125mm-0.200mm (0.005-0.008"), with suitable reductions, give the best results.

Evaluations have shown that the best overall performance is achieved using the stencil design

shown in following figure. This design is for a stencil thickness of 0.127mm (0.005"). The reduction

should be adjusted for stencils of other thicknesses.

Stencil pad sizing (all dimensions in mm)

Stencil pad spacing (all dimensions in mm)