TLC272CPWR datasheet(3/51 Pages) TI

部件名	TLC272CPWR

功能描述	LinCMOS田?PRECISION DUAL OPERATIONAL AMPLIFIERS

PDF	51 Pages

Scroll/Zoom	100%

制造商	TI [Texas Instruments]

网页	http://www.ti.com

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3 / 51 page

TLC272, TLC272A, TLC272B, TLC272Y, TLC277

LinCMOS

 PRECISION DUAL OPERATIONAL AMPLIFIERS

SLOS091E – OCTOBER 1987 – REVISED FEBRUARY 2002

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

equivalent schematic (each amplifier)

OUT

GND

IN +

IN –

VDD

TLC272Y chip information

This chip, when properly assembled, displays characteristics similar to the TLC272C. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive

epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (4) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

–

1OUT

1IN +

1IN –

VDD

(8)

(6)

(3)

(2)

(5)

(1)

–

(7)

2IN +

2IN –

2OUT

(4)

GND

TLC272CPWR 数据表(PDF) 3 Page - Texas Instruments

TLC272CPWR 数据表(HTML) 3 Page - Texas Instruments

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