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PCF8564AUG 数据表(PDF) 37 Page - NXP Semiconductors

部件名 PCF8564AUG
功能描述  Real time clock and calendar
PDF  48 Pages
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制造商  NXP [NXP Semiconductors]
网页  http://www.nxp.com
标志 NXP - NXP Semiconductors

PCF8564AUG 数据表(HTML) 37 Page - NXP Semiconductors

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PCF8564A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 3 — 26 August 2013
37 of 48
NXP Semiconductors
PCF8564A
Real time clock and calendar
[1]
Pressure of diamond head: 10 g to 50 g.
Table 34.
Pin location of all PCF8564A types
All x/y coordinates represent the position of the center of each pin with respect to the center (x/y = 0)
of the chip; see Figure 27 and Figure 28.
Symbol
Pad
X (
m)
Y (
m)
Description
OSCI
1
523.0
689.4
oscillator input
OSCO
2
523.0
469.4
oscillator output
INT
3
523.0
429.8
open-drain interrupt output (active LOW)
VSS
4
523.0
684.4
ground (substrate)
SDA
5
524.9
523.8
serial data I/O
SCL
6
524.9
138.6
serial clock input
CLKOUT
7
524.9
162.5
CMOS push-pull clock output
VDD
8
524.9
443.3
supply
CLKOE
9
524.9
716.3
CLKOUT output enable
Fig 29. Alignment marks of all PCF8564A types
Table 35.
Alignment marks of all PCF8564A types
All x/y coordinates represent the position of the REF point (see Figure 29) with respect to the center
(x/y = 0) of the chip; see Figure 27 and Figure 28.
Alignment markers
Size (
m)
X (
m)
Y (
m)
C1
100
 100
465.2
826.3
C2
100
 100
523.0
890.0
F90
 117
569.9
885.5
Table 36.
Gold bump hardness
Type number
Min
Max
Unit[1]
PCF8564AUG/12HB/1
35
80
HV



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