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ADP1755ACPZ-R7 数据表(PDF) 16 Page - Analog Devices

部件名 ADP1755ACPZ-R7
功能描述  1.2 A, Low VIN, Low Dropout Linear Regulator
PDF  20 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADP1755ACPZ-R7 数据表(HTML) 16 Page - Analog Devices

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ADP1754/ADP1755
Data Sheet
Rev. E | Page 16 of 20
140
120
100
80
60
40
20
0
0.25
0.75
1.25
1.75
2.25
2.75
VIN – VOUT (V)
MAX JUNCTION
TEMPERATURE
LOAD = 10mA
LOAD = 100mA
LOAD = 200mA
LOAD = 400mA
LOAD = 800mA
LOAD = 1.2A
Figure 36. 6400 mm2 of PCB Copper, TA = 25°C, LFCSP
140
120
100
80
60
40
20
0
0.25
0.75
1.25
1.75
2.25
2.75
VIN – VOUT (V)
MAX JUNCTION
TEMPERATURE
LOAD = 10mA
LOAD = 100mA
LOAD = 200mA
LOAD = 400mA
LOAD = 800mA
LOAD = 1.2A
Figure 37. 500 mm2 of PCB Copper, TA = 25°C, LFCSP
140
120
100
80
60
40
20
0
0.25
0.75
1.25
1.75
2.25
2.75
VIN – VOUT (V)
MAX JUNCTION
TEMPERATURE
LOAD = 10mA
LOAD = 100mA
LOAD = 200mA
LOAD = 400mA
LOAD =
800mA
LOAD = 1.2A
Figure 38. 0 mm2 of PCB Copper, TA = 25°C, LFCSP
140
120
100
80
60
40
20
0
0.25
0.75
1.25
1.75
2.25
2.75
VIN – VOUT (V)
MAX JUNCTION
TEMPERATURE
LOAD = 10mA
LOAD = 200mA
LOAD = 400mA
LOAD = 800mA
LOAD = 1.2A
LOAD = 100mA
Figure 39. 6400 mm2 of PCB Copper, TA = 50°C, LFCSP
140
120
100
80
60
40
20
0
0.25
0.75
1.25
1.75
2.25
2.75
VIN – VOUT (V)
MAX JUNCTION
TEMPERATURE
LOAD = 10mA
LOAD = 100mA
LOAD = 200mA
LOAD = 400mA
LOAD = 800mA
LOAD = 1.2A
Figure 40. 500 mm2 of PCB Copper, TA = 50°C, LFCSP
140
120
100
80
60
40
20
0
0.25
0.75
1.25
1.75
2.25
2.75
VIN – VOUT (V)
MAX JUNCTION
TEMPERATURE
LOAD = 10mA
LOAD = 100mA
LOAD = 200mA
LOAD = 400mA
LOAD =
800mA
LOAD = 1.2A
Figure 41. 0 mm2 of PCB Copper, TA = 50°C, LFCSP
In cases where the board temperature is known, the thermal
characterization parameter, ΨJB, can be used to estimate the
junction temperature rise. Maximum junction temperature (TJ)
is calculated from the board temperature (TB) and power
dissipation (PD) using the following formula:
TJ = TB + (PD × ΨJB)
(7)



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