ADCLK914

Rev. A | Page 11 of 12

*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2

EXCEPT FOR EXPOSED PAD DIMENSION.

OUTLINE DIMENSIONS

1

0.50

BSC

0.60 MAX

PIN 1

INDICATOR

1.50 REF

0.50

0.40

0.30

0.25 MIN

0.45

2.75

BSC SQ

TOP

VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

3.00

BSC SQ

0.90

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

*1.65

1.50 SQ

1.35

16

5

13

8

9

12

4

EXPOSED

PAD

BOTTOM VIEW

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 20. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

3 mm × 3 mm Body, Very Thin Quad

(CP-16-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADCLK914BCPZ-WP1

−40°C to +125°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-16-3

ADCLK914BCPZ-R71

−40°C to +125°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-16-3

ADCLK914BCPZ-R21

−40°C to +125°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-16-3

ADCLK914/PCBZ1

Evaluation Board