MPC8323E datasheet(49/82 Pages) FREESCALE

部件名	MPC8323E

功能描述	PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications

PDF	82 Pages

Scroll/Zoom	100%

制造商	FREESCALE [Freescale Semiconductor, Inc]

网页	http://www.freescale.com

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49 / 82 page

MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4

Freescale Semiconductor

Package and Pin Listings

21 Package and Pin Listings

This section details package parameters, pin assignments, and dimensions. The MPC8323E is available in

a thermally enhanced Plastic Ball Grid Array (PBGA); see Section 21.1, “Package Parameters for the

MPC8323E PBGA,” and Section 21.2, “Mechanical Dimensions of the MPC8323E PBGA,” for

information on the PBGA.

21.1

Package Parameters for the MPC8323E PBGA

The package parameters are as provided in the following list. The package type is 27 mm

× 27 mm, 516

PBGA.

Package outline

27 mm

× 27 mm

Interconnects

516

Pitch

1.00 mm

Module height (typical)

2.25 mm

Solder Balls

62 Sn/36 Pb/2 Ag (ZQ package)

95.5 Sn/0.5 Cu/4Ag (VR package)

Ball diameter (typical)

0.6 mm

21.2

Mechanical Dimensions of the MPC8323E PBGA

Figure 42 shows the mechanical dimensions and bottom surface nomenclature of the MPC8323E,

516-PBGA package.

MPC8323E 数据表(PDF) 49 Page - Freescale Semiconductor, Inc