MPC8271VR datasheet(56/61 Pages) FREESCALE

部件名	MPC8271VR

功能描述	PowerQUICC II Family Hardware Specifications

PDF	61 Pages

Scroll/Zoom	100%

制造商	FREESCALE [Freescale Semiconductor, Inc]

网页	http://www.freescale.com

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MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 3

Freescale Semiconductor

Package Description

This figure shows the side profile of the PBGA package to indicate the direction of the top surface view.

Figure 13. Side View of the PBGA Package Remove

9.1

Package Parameters

This table provides package parameters.

NOTE: Temperature Reflow for the VR Package

In the VR package, sphere composition is lead-free (see Table 2). This

requires higher temperature reflow than what is required for other

PowerQUICC II packages. Consult “Freescale PowerQUICC II Pb-Free

Packaging Information” (MPC8250PBFREEPKG) available on

www.freescale.com.

Table 22. Package Parameters

Code

Type

Outline

(mm)

Interconnects

Pitch

(mm)

Nominal Unmounted

Height (mm)

VR, ZQ

PBGA

27 x 27

516

2.25

Die

Transfer molding compound

1 mm pitch

Wire bonds

attach

DIE

Ball bond

Screen-printed

solder mask

Cu substrate traces

Resin glass epoxy

Plated substrate via

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