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VMV3 数据表(PDF) 26 Page - Microsemi Corporation |
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VMV3 数据表(HTML) 26 Page - Microsemi Corporation |
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26 / 212 page ![]() Military ProASIC3/EL DC and Switching Characteristics 2-12 Revision 3 Table 2-14 • Summary of I/O Input Buffer Power (per pin) – Default I/O Software Settings Applicable to Advanced I/O Banks for A3P250 and A3P1000 Only VMV (V) Static Power PDC6 (mW)1 Dynamic Power PAC9 (µW/MHz)2 Single-Ended 3.3 V LVTTL / 3.3 V LVCMOS 3.3 – 16.22 3.3 V LVCMOS – Wide Range 3.3 – 16.22 2.5 V LVCMOS 2.5 – 4.65 1.8 V LVCMOS 1.8 – 1.65 1.5 V LVCMOS (JESD8-11) 1.5 – 0.98 3.3 V PCI 3.3 – 17.64 3.3 V PCI-X 3.3 – 17.64 Differential LVDS 2.5 2.26 0.83 LVPECL 3.3 5.72 1.81 Notes: 1. PDC6 is the static power (where applicable) measured on VMV. 2. PAC9 is the total dynamic power measured on VMV. Table 2-15 • Summary of I/O Input Buffer Power (per pin) – Default I/O Software Settings Applicable to Standard Plus I/O Banks for A3P250 and A3P1000 Only VMV (V) Static Power PDC6 (mW) 1 Dynamic Power PAC9 (µW/MHz) 2 Single-Ended 3.3 V LVTTL / 3.3 V LVCMOS 3.3 – 16.23 3.3 V LVCMOS – Wide Range 3.3 – 16.23 2.5 V LVCMOS 2.5 – 4.66 1.8 V LVCMOS 1.8 – 1.64 1.5 V LVCMOS (JESD8-11) 1.5 – 0.99 3.3 V PCI 3.3 – 17.64 3.3 V PCI-X 3.3 – 17.64 Notes: 1. PDC6 is the static power (where applicable) measured on VMV. 2. PAC9 is the total dynamic power measured on VMV. |
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