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ADP7105ACPZ-R2 数据表(PDF) 23 Page - Analog Devices |
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ADP7105ACPZ-R2 数据表(HTML) 23 Page - Analog Devices |
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23 / 28 page ![]() Data Sheet ADP7105 Rev. 0 | Page 23 of 28 In the case where the board temperature is known, use the ΨJB thermal characterization parameter to estimate the junction temperature rise (see Figure 77 and Figure 78). Maximum junction temperature (TJ) is calculated from the board tempera- ture (TB) and power dissipation (PD) using the following formula: TJ = TB + (PD × ΨJB) (5) The typical value of ΨJB is 15.1°C/W for the 8-lead LFCSP package and 31.3°C/W for the 8-lead SOIC package (see Table 7). Figure 77. LFCSP Figure 78. SOIC TOTAL POWER DISSIPATION (W) 0 20 40 60 80 100 120 140 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 TB = 25°C TB = 50°C TB = 65°C TB = 85°C TJ MAX TOTAL POWER DISSIPATION (W) 0 20 40 60 80 100 120 140 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 TB = 25°C TB = 50°C TB = 65°C TB = 85°C TJ MAX |
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