Data Sheet

ADP7105

Rev. 0 | Page 25 of 28

OUTLINE DIMENSIONS

Figure 81. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]

3 mm × 3 mm Body, Very Very Thin, Dual Lead

(CP-8-5)

Dimensions shown in millimeters

Figure 82. 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP]

Narrow Body

(RD-8-2)

Dimensions shown in millimeters

PIN 1

INDICATOR

(R 0.2)

BOTTOM VIEW

TOP VIEW

1

4

8

5

INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

0.30

0.25

0.18

0.05 MAX

0.02 NOM

0.80 MAX

0.55 NOM

0.20 REF

0.50 BSC

COPLANARITY

0.08

2.48

2.38

2.23

1.74

1.64

1.49

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-WEED-4

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.20 MIN

EXPOSED

PAD

3.10

3.00 SQ

2.90

COMPLIANT TO JEDEC STANDARDS MS-012-A A

1.27

0.40

1.75

1.35

2.41

0.356

0.457

4.00

3.90

3.80

6.20

6.00

5.80

5.00

4.90

4.80

0.10 MAX

0.05 NOM

3.81 REF

0.25

0.17

8°

0°

0.50

0.25

45°

COPLANARITY

0.10

1.04 REF

8

1

4

5

1.27 BSC

SEATING

PLANE

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

BOTTOM VIEW

TOP VIEW

0.51

0.31

1.65

1.25

3.098