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MCP111 数据表(PDF) 23 Page - Microchip Technology |
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MCP111 数据表(HTML) 23 Page - Microchip Technology |
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23 / 28 page  2004-2013 Microchip Technology Inc. DS21906C-page 23 MCP102/103/121/131 APPENDIX A: REVISION HISTORY Revision C (January 2013) • Added a note to each package outline drawing. Revision B (March 2005) The following is the list of modifications: 1. Added Section 4.4 “Using in PIC® Microcon- troller, ICSP™ Applications (MCP121 only)” on using the MCP121 in PIC microcontroller ICSP applications. 2. Added VODH specifications in Section 1.0 “Electrical Characteristics” (for ICSP applications). 3. Added Figure 2-33. 4. Updated SC-70 package markings and added Pb-free marking information to Section 5.0 “Packaging information”. 5. Added Appendix A: “Revision History”. Revision A (August 2004) • Original Release of this Document. |
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