 2004-2013 Microchip Technology Inc.

DS21906C-page 19

MCP102/103/121/131

3-Lead Plastic Transistor Outline (TO) (TO-92)

4

3

2

4

3

2



Mold Draft Angle Bottom

6

5

4

6

5

4



0.56

0.48

0.41

.022

.019

.016

B

Lead Width

0.51

0.43

0.36

.020

.017

.014

c

Lead Thickness

2.41

2.29

2.16

.095

.090

.085

R

Molded Package Radius

4.95

4.64

4.32

.195

.183

.170

D

Overall Length

4.95

4.71

4.45

.195

.186

.175

E1

Overall Width

3.94

3.62

3.30

.155

.143

.130

A

Bottom to Package Flat

1.27

.050

p

Pitch

3

3

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

R

n

1

3



p

L

B

A

c



1

D

2

E1

Tip to Seating Plane

L

.500

.555

.610

12.70

14.10

15.49

*Controlling Parameter

Mold Draft Angle Top

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: TO-92

Drawing No. C04-101

Note:

For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging