Copyright

© ANPEC Electronics Corp.

Rev. B.4 - Mar., 2008

APL5331

www.anpec.com.tw

18

Package Information

SOP-8P

0.020

0.010

0.020

0.050

0.006

0.069

MAX.

0.40

L

0

E

e

h

E1

0.25

D

c

b

0.17

0.31

0.016

1.27

0.50

1.27 BSC

0.51

0.25

0.050 BSC

0.010

0.012

0.007

MILLIMETERS

MIN.

S

Y

M

B

O

L

A1

A2

A

0.00

1.25

SOP-8P

MAX.

0.15

1.75

MIN.

0.000

0.049

INCHES

D1

2.25

0.098

2.00

0.079

E2

3.50

3.00

0.138

0.118

8

0

8

°

0

°

°

°

°

D

e

SEE VIEW

A

c

b

D1

THERMAL

PAD

L

VIEW A

SEATING PLANE

GAUGE PLANE

Inter-lead flash and protrusions shall not exceed 10 mil per side.

Note : 1. Follow JEDEC MS-012 BA.

2. Dimension "D" does not include mold flash, protrusions

or gate burrs. Mold flash, protrusion or gate burrs shall not

exceed 6 mil per side .

3. Dimension "E" does not include inter-lead flash or protrusions.

4.80

5.00

5.80

6.20

3.80

4.00

0.244

0.228

0.157

0.150

0.197

0.189