Copyright

© ANPEC Electronics Corp.

Rev. B.4 - Mar., 2008

APL5331

www.anpec.com.tw

2

Package Code

K : SOP-8

KA : SOP-8P

U5 : TO-252-5

G5 : TO-263-5

Operating Ambient Temperature Range

Handling Code

TR : Tape & Reel

Assembly Material

L : Lead Free Device

G : Halogen and Lead Free Device

APL5331

Handling Code

Temperature Range

Package Code

APL5331

XXXXX

APL5331 K :

APL5331 KA :

XXXXX - Date Code

APL5331

XXXXX

APL5331 U5 :

APL5331 G5 :

XXXXX - Date Code

Assembly Material

Ordering and Marking Information

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Symbol

Parameter

Rating

Unit

VCNTL Supply Voltage, VCNTL to GND

-0.2 ~ 7

V

VIN Supply Voltage, VIN to GND

-0.2 ~ 3.9

V

Power Dissipation

Internally Limited

W

Junction Temperature

150

Storage Temperature

-65 ~ 150

Lead Soldering Temperature, 10 Seconds

260

Absolute Maximum Ratings

Thermal Characteristics

Symbol

Parameter

Value

Unit

θ

JA

Junction-to-Ambient Thermal Resistance in Free Air

SOP-8

SOP-8P

TO-252-5

TO-263-5

75

55

42

34

θ

JC

Junction-to-Case Thermal Resistance

SOP-8

SOP-8P

TO-252-5

TO-263-5

28

20

12

11

Note :

θ

of SOP-8P is soldered directly on the PCB.