Ceramic Discriminators Notice

1. Standard Reflow Soldering Conditions

(1) Reflow

CFC alternatives (HCFC Series), Isopropyl Alcohol (IPA),

Water (Demineralized Water), Cleaning Water Solution

(Cleanthrough-750H, Pine Alpha 100S), Silicon

(Technocare FRW)

2. Wash

(1) Cleaning Solvent

o Immersion Wash

2 minutes max. in above solvent at +60°C max.

o Shower or Rinse Wash

2 minutes max. in above solvent at +60°C max.

(2) Cleaning Conditions

o When components are immersed in solvent, be sure to

maintain the temperature of components below the

temperature of solvent.

o Please do not use ultrasonic cleaning.

o Total washing time should be within 4 minutes.

o Please ensure the component is thoroughly evaluated

in your application circuit.

o Please do not use chlorine, petroleum or alkaline

cleaning solvents.

o If you plan to use any other type of solvents, please

consult with Murata or Murata representative prior to

using.

(3) Notice

Electrode is directly soldered with the tip of soldering iron

at +350±5°C for 3.0±0.5 seconds.

(2) Soldering Iron

Peak

(260°C max.)

Heating

(230°C)

Gradual

Cooling

Pre-heating

(150-180°C)

100

230

260

60-120 sec.

40 sec.

max.

30 sec.

min.

120 sec.

min.

Filter is soldered twice within the following temperature

conditions.

c CDBKB Series Notice (Soldering and Mounting)

Continued on the following page.

c CDBKB Series Notice (Handling)

P05E.pdf

Nov.24,2011

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

1. The component will be damaged when an excessive

stress is applied.

2. If the component is cleaned, please confirm

that the reliability has not been degraded.

3. In case of covering filter with over coating,

conditions such as material of resin, cure

temperature, and so on should be evaluated

carefully.

4. Do not use strong acidity flux, more than 0.2wt%

chlorine content, in reflow soldering.

5. The product, packed in a moisture-proof bag (dry

pack), is sensitive to moisture.

The following treatment is required before

applying reflow soldering, to avoid package

cracks or reliability degradation caused by

thermal stress. When unpacked, store the component

in an atmosphere of below 25 degrees C. and below

65%R.H., and solder within 48 hours.