MHz SMD Type CERAFIL

r Notice

Continued on the following page.

Filter is soldered twice within the following temperature

conditions.

1. Standard Reflow Soldering Conditions

(1) Reflow

Filter is soldered at +280±5°C for 3.0±0.5 seconds. The

soldering iron should not touch the filter while soldering.

(2) Soldering Iron

The component is recommended with placement

machines that employ optical placement capabilities. The

component might be damaged by excessive mechanical

force. Please make sure that you have evaluated by

using placement machines before going into mass

production. Do not use placement machines that utilize

mechanical positioning. Please contact Murata for details

beforehand.

(3) Condition for Placement Machines

(a) The component may be damaged if excess

mechanical stress is applied to it mounted on the

printed circuit board.

(b) Design layout of components on the PC board to

minimize the stress imposed on the warp or flexure of

the board.

(c) After installing components, if solder is excessively

applied to the circuit board, mechanical stress will

cause destruction resistance characteristics to

degrade. To prevent this, be extremely careful in

determining shape and dimension before designing

the circuit board diagram.

(d) When the positioning claws and pick-up nozzle are

worn, the load is applied to the components while

positioning is concentrated on positioning accuracy,

etc. Careful checking and maintenance are necessary

to prevent unexpected trouble.

(e) When correcting components with a soldering iron,

the tip of the soldering iron should not directly touch

the component.

(f) Do not use strong acidity flux, more than 0.2wt%

chlorine content, in reflow soldering.

(4) Other

o Soldering and Mounting

Peak

(240°C max.)

Heating

(230°C)

Gradual

Cooling

Pre-heating

(150-180°C)

100

230

240

60-120 sec.

30 sec.

max.

30 sec.

min.

120 sec.

min.

[Component Direction]

Place the compon-

ent laterally to the

direction in which

stress acts.

[Component Layout Close to Board]

Susceptibility to

stress is in the order

of : A>C>B

B

A

C

Slit

Perforation

c SFSCE10M7WF03-R0 Notice

P05E.pdf

Nov.24,2011

27

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.