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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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W25Q80BWSVIP 数据表(PDF) 70 Page - Winbond |
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W25Q80BWSVIP 数据表(HTML) 70 Page - Winbond |
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70 / 74 page  W25Q80BW - 70 - 8-Pad WSON 6x5- mm Cont’d. SYMBOL MILLIMETERS INCHES Min Nom Max Min Nom Max SOLDER PATTERN M 3.40 0.134 N 4.30 0.169 P 6.00 0.236 Q 0.50 0.020 R 0.75 0.026 Notes: 1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package. 4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of exposed PCB vias under the pad. |
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