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AM186ES-25KC/W 数据表(PDF) 55 Page - Advanced Micro Devices

部件名 AM186ES-25KC/W
功能描述  High Performance, 80C186-/80C188-Compatible and 80L186-/80L188-Compatible, 16-Bit Embedded Microcontrollers
PDF  102 Pages
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制造商  AMD [Advanced Micro Devices]
网页  http://www.amd.com
标志 AMD - Advanced Micro Devices

AM186ES-25KC/W 数据表(HTML) 55 Page - Advanced Micro Devices

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Am186/188ES and Am186/188ESLV Microcontrollers
55
P R E L IMINAR Y
THERMAL CHARACTERISTICS
TQFP Package
The Am186ES and Am188ES microcontrollers are
specified for operation with case temperature ranges
from 0
°C to +100°C for a commercial device. Case
temperature is measured at the top center of the
pa ck age as shown in Figu re 13. The various
tem pe ra ture s and the rma l resist an ce s ca n be
determined using the equations in Figure 14 with
information given in Table 10.
θ
JA is the total thermal resistance. θJA is the sum of θJC,
the internal thermal resistance of the assembly, and
θ
CA, the case to ambient thermal resistance.
The variable
P is power in watts. Typical power supply
current (ICC) is TBD mA per MHz of clock frequency.
Figure 13.
Thermal Resistance(
°C/Watt)
Figure 14.
Thermal Characteristics Equations
Table 10.
Thermal Characteristics (
°C/Watt)
θ
JA
θ
CA
θ
JC
θ
JA = θJC + θCA
TC
Package/Board
Airflow
(Linear Feet
per Minute)
θ
JA
θ
JC
θ
CA
PQFP/2-Layer
0 fpm
45
7
38
200 fpm
39
7
32
400 fpm
35
7
28
600 fpm
33
7
26
TQFP/2-Layer
0 fpm
56
10
46
200 fpm
461036
400 fpm
401030
600 fpm
381028
PQFP/4-Layer
to 6-Layer
0 fpm
23518
200 fpm
21
5
16
400 fpm
19
5
14
600 fpm
17
5
12
TQFP/4-Layer
to 6-Layer
0 fpm
30624
200 fpm
28
6
22
400 fpm
26
6
20
600 fpm
24
6
18
θ
JA = θJC + θCA
P=ICC
⋅ freq (MHz) ⋅ V
CC
TJ=TC+( P
⋅θ
JC )
TJ=TA+ ( P
⋅θ
JA )
TC=TJ–( P
⋅θ
JC )
TC=TA+( P
⋅θ
CA )
TA=TJ–( P
⋅θ
JA )
TA=TC–( P
⋅θ
CA )



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