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LPC2132FHN64 数据表(PDF) 26 Page - NXP Semiconductors |
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LPC2132FHN64 数据表(HTML) 26 Page - NXP Semiconductors |
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26 / 45 page ![]() LPC2131_32_34_36_38 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 2 February 2011 26 of 45 NXP Semiconductors LPC2131/32/34/36/38 Single-chip 16/32-bit microcontrollers 7. Limiting values [1] The following applies to the Limiting values: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. [2] Including voltage on outputs in 3-state mode. [3] Not to exceed 4.6 V. [4] The peak current is limited to 25 times the corresponding maximum current. [5] Dependent on package type. [6] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k Ω series resistor. Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit VDD supply voltage (core and external rail) −0.5 +3.6 V VDDA analog 3.3 V pad supply voltage −0.5 +4.6 V Vi(VBAT) input voltage on pin VBAT for the RTC −0.5 +4.6 V Vi(VREF) input voltage on pin VREF −0.5 +4.6 V VIA analog input voltage on ADC related pins −0.5 +5.1 V VI input voltage 5 V tolerant I/O pins; only valid when the VDD supply voltage is present [2] −0.5 +6.0 V other I/O pins [2][3] −0.5 VDD + 0.5 V IDD supply current per supply pin [4] -100 mA ISS ground current per ground pin [4] -100 mA Tstg storage temperature [5] −40 +125 °C Ptot(pack) total power dissipation (per package) based on package heat transfer, not device power consumption -1.5 W VESD electrostatic discharge voltage human body model [6] all pins −4000 +4000 V |
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