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Revision 2.4

5 - 44

AS5030

Datasheet - Absolute Maximum Rat i ngs

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 6 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Symbol

Parameter

Min

Max

Units

Comments

Electrical Parameters

Supply voltage

-0.3

7

V

Except during OTP programming

Input pin voltage

VSS - 0.5 VDD + 0.5

V

Input current (latch-up immunity)

-100

100

mA

Norm: Jedec 78

Electrostatic Discharge

ESD

Electrostatic Discharge

±2

kV

Norm: MIL 883 E method 3015

Package thermal resistance

137

°C/W

Still Air / Single Layer PCB

89

°C/W

Still Air / Multilayer PCB

Temperature Ranges and Storage Conditions

Storage temperature

-55

+150

°C

Min -67ºF; Max +257ºF

Body temperature

260

°C

The reflow peak soldering temperature

(body temperature) specified is in

accordance with IPC/JEDEC J-STD-020

“Moisture/Reflow Sensitivity Classification

for Non-Hermetic Solid State Surface

Mount Devices”.

The lead finish for Pb-free leaded packages

is matte tin (100% Sn).

Humidity non-condensing

5

85

%

MSL

Moisture Sensitive Level

3

Represents a maximum floor time of 168h