Application information

L6235

26/35

DocID7618 Rev 2

Figure 23. Typical application

11.1

Output current capability and IC power dissipation

In Figure 24 is shown the approximate relation between the output current and the IC power

dissipation using PWM current control.

For a given output current the power dissipated by the IC can be easily evaluated, in order

to establish which package should be used and how large must be the on-board copper

dissipating area to guarantee a safe operating junction temperature (125 °C maximum).

Figure 24. IC power dissipation versus output power