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数据搜索系统，热门电子元器件搜索 |
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L6235PD 数据表(PDF) 5 Page - STMicroelectronics |
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L6235PD 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 35 page  DocID7618 Rev 2 5/35 L6235 Maximum ratings 35 Table 3. Thermal data Symbol Description PDIP24 SO24 PowerSO36 Unit Rth(j-pins) Maximum thermal resistance junction pins 18 14 C/W Rth(j-case) Maximum thermal resistance junction case 1 C/W Rth(j-amb)1 Maximum thermal resistance junction ambient(1) 43 51 - C/W Rth(j-amb)1 Maximum thermal resistance junction ambient(2) -- 35 C/W Rth(j-amb)1 Maximum thermal resistance junction ambient(3) -- 15 C/W Rth(j-amb)2 Maximum thermal resistance junction ambient(4) 58 77 62 C/W 1. Mounted on a multilayer FR4 PCB with a dissipating copper surface on the bottom side of 6 cm2 (with a thickness of 35 µm). 2. Mounted on a multilayer FR4 PCB with a dissipating copper surface on the top side of 6 cm2 (with a thickness of 35 µm). 3. Mounted on a multilayer FR4 PCB with a dissipating copper surface on the top side of 6 cm2 (with a thickness of 35 µm), 16 via holes and a ground layer. 4. Mounted on a multilayer FR4 PCB without any heatsinking surface on the board. |
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