OPA830-EP

SBOS655 – MARCH 2014

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6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Dual supply voltage

±5

±5.5

V

Single supply voltage

5

11

V

Operating junction temperature

-40

105

°C

6.4 Thermal Information

OPA830-EP

UNIT

DBV (5 TERMINAL)

Junction-to-ambient thermal resistance

218.8

Junction-to-case (top) thermal resistance

87.0

Junction-to-board thermal resistance

45.2

°C/W

Junction-to-top characterization parameter

4.4

Junction-to-board characterization parameter

44.4

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

At -40°C

OPA830TDBV

PARAMETER

CONDITIONS

UNIT

MIN

TYP

MAX

310

65

120

Small-Signal Bandwidth

MHz

15

25

6

11

Gain-Bandwidth Product

G

≥ +10, -40°C to 85°C

80

110

MHz

Peaking at a Gain of +1

6

dB

Slew Rate

G = +2, 2V Step, -40°C to 85°C

260

600

V/

μs

Rise Time

0.5V Step, -40°C to 85°C

3.3

5.9

ns

Fall Time

0.5V Step, -40°C to 85°C

3.5

6

ns

Settling Time to 0.1%

G = +2, 1V Step, -40°C to 85°C

42

66

ns

Harmonic Distortion

–67

−56

2nd-Harmonic

dBc

–71

−60

–60

−48

3rd-Harmonic

dBc

–77

−59

Input Voltage Noise

f > 1MHz, -40°C to 85°C

9.5

11.5

nV/

√Hz

Input Current Noise

f > 1MHz, -40°C to 85°C

3.7

5.7

pA/

√Hz

NTSC Differential Gain

0.07%

NTSC Differential Phase

0.17

°

(1)

Limits set by simulation based on

−40°C to 85°C.

4

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