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MAS110S 数据表(PDF) 4 Page - Dynex Semiconductor

部件名 MAS110S
功能描述  Fast Turn-off Asymmetric Thyristor/Diode Module
PDF  9 Pages
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制造商  DYNEX [Dynex Semiconductor]
网页  http://www.dynexsemi.com
标志 DYNEX - Dynex Semiconductor

MAS110S 数据表(HTML) 4 Page - Dynex Semiconductor

  MAS110S Datasheet HTML 1Page - Dynex Semiconductor MAS110S Datasheet HTML 2Page - Dynex Semiconductor MAS110S Datasheet HTML 3Page - Dynex Semiconductor MAS110S Datasheet HTML 4Page - Dynex Semiconductor MAS110S Datasheet HTML 5Page - Dynex Semiconductor MAS110S Datasheet HTML 6Page - Dynex Semiconductor MAS110S Datasheet HTML 7Page - Dynex Semiconductor MAS110S Datasheet HTML 8Page - Dynex Semiconductor MAS110S Datasheet HTML 9Page - Dynex Semiconductor  
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MAS110S
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THERMAL AND MECHANICAL DATA
Conditions
Min.
Max.
Units
Thermal resistance - junction to case
(Thyristor or diode)
R
th(j-c)
Symbol
Parameter
dc
oC/W
0.21
-
Mounting force 6Nm
with mounting compound.
Thermal resistance - case to heatsink
(Thyristor or diode)
0.07
-
oC/W
R
th(c-h)
125
oC
T
vj
Virtual junction temperature
T
stg
Storage temperature range
V
isol
Isolation voltage
-
2.5
kV
-40
125
oC
-40
-
-
125
oC
-
T
op
Operating temperature range
Commoned terminals to base plate.
AC RMS, 1 min, 50Hz.
-
Mounting torque
-
6.0
Nm
ORDERING INFORMATION
The module type number is made up as follows:
MAS XXX S XX W
Nominal I
F(AV)
at T
case
= 75˚C
Single thyristor/diode configuration
Voltage grade. V
DRM
/100
Turn-off time code
Examples:
MAS 110 S 12 W
MAS 110 S 08 X
MODULE MOUNTING RECOMMENDATIONS
s Adequate heatsinking is required to maintain the base
temperature at 75
oC if full rated current is to be achieved. Power
dissipation may be calculated by use of V
T(TO) and rT information
and loss curves in accordance with standard formulae. We can
provide assistance with calculations or choice of heatsink if required.
s The heatsink surface must be smooth and flat; a surface finish
of N6 (32
µin) and a flatness within 0.05mm (0.002") are
recommended.
s Immediately prior to mounting, the heatsink surface should be
lightly scrubbed with fine emery, Scotch Brite™ or a mild chemical
etchant and then cleaned with a solvent to remove oxide build up
and foreign material. Care should be taken to ensure no foreign
particles remain.
s An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces. This
should ideally be 0.05mm (0.002") per surface to ensure optimum
thermal performance.
s After application of thermal compound, place the module squarely
over the mounting holes, (or 'T' slots) in the heatsink. Using a
torque wrench, slowly tighten the recommended fixing bolts at
each end, rotating each in turn no more than 1/4 of a revolution at
a time. Continue until the required torque of 6Nm (55lb.ins) is
reached at both ends.
s It is not acceptable to fully tighten one fixing bolt before starting
to tighten the others. Such action may DAMAGE the module.
Pressure contact asymmetric thyristor/diode module



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