EM357 Mini Modules

Page 11

This document is subject to change without notice

Document No: 0011-00-07-00-000 (Issue H)

PROCESSING

Recommended Reflow Profile

Parameter Values

3º/sec max

Minimum Soak Temperature

150ºC

Maximum Soak Temperature

200ºC

Soak Time

60-120 sec

217ºC

60-150 sec

250ºC

20-30 sec

8 min max

Ramp down rate

6ºC/sec max

Pb-Free Solder Paste

Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.

Specification. See the Castellated Terminations Section in the latest IPC-A-610 Acceptability of Electronic Assemblies document.

Cleaning

In general, cleaning the populated module is strongly discouraged. Residuals under the module cannot be easily

removed with any cleaning process.

• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host

board and the module. The combination of soldering flux residuals and encapsulated water could lead to

short circuits between neighboring pads. Water could also damage any stickers or labels.

• Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two

housings, which is not accessible for post-washing inspection. The solvent could also damage any

stickers or labels.

• Ultrasonic cleaning could damage the module permanently.

The best approach is to consider using a “No Clean” solder paste and eliminate the post-soldering cleaning step.

Optical Inspection

After soldering the module to the host board, consider optical inspection to check the following:

• Proper alignment and centering of the module over the pads

• Proper solder joints on all pads

• Excessive solder or contacts to neighboring pads or vias

Repeating Reflow Soldering

Only a single reflow soldering process is encouraged for host boards.

Wave Soldering

If a wave soldering process is required on the host boards due to the presence of leaded components, only a

single wave soldering process is encouraged.

Hand Soldering

Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document

IPC-7711).