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ACST2 数据表(PDF) 5 Page - STMicroelectronics |
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ACST2 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 13 page ![]() DocID13304 Rev 4 5/13 ACST2 Characteristics 13 Figure 10. Relative variation of critical rate of decrease of main current versus junction temperature Figure 11. Surge peak on-state current versus number of cycles 0 2 4 6 8 10 12 14 16 18 20 25 50 75 100 125 (dI/dt) c [Tj]/ (dI/dt)c [Tj=125 °C] V OUT=300 V Tj(°C) 0 1 2 3 4 5 6 7 8 9 1 10 100 1000 I TSM(A) Non repetitive T j initial=25 °C Repetitive T C=110 °C One cycle t=20ms Number of cycles Figure 12. Non repetitive surge peak on-state current and corresponding value of I²t Figure 13. On-state characteristics (maximum values) 0.1 1.0 10.0 100.0 0.01 0.10 1.00 10.00 I TSM(A), I²t (A²s) T j initial=25 °C I TSM I²t tP(ms) sinusoidal pulse with width t < 10 ms P 1.E-02 1.E-01 1.E+00 1.E+01 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 ITM(A) TJ max. : VTO= 0.90 V RD= 250 mΩ Tj=25 °C Tj=125 °C VTM(V) Figure 14. Thermal resistance junction to ambient versus copper surface under tab DPAK Figure 15. Relative variation of clamping voltage VCL versus junction temperature 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 30 35 40 R th(j-a)( °C /W) DPAK SCU(cm ²) Printed circuitboard FR 4, copperthickness = 35 µm 0.85 0.90 0.95 1.00 1.05 1.10 1.15 1.20 -40 -20 0 20 40 60 80 100 120 140 V CL [Tj]/ VCL [Tj=25 °C] Tj(°C) |
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