2

AT45DB321D [DATASHEET]

3597T–DFLASH–11/2013

1.

Description

The AT45DB321D is a 2.5V or 2.7V, serial interface, sequential access flash memory ideally suited for a wide variety of digital

voice-, image-, program code-, and data-storage applications. The AT45DB321D supports the RapidS serial interface for

applications requiring very high speed operations. The RapidS serial interface is SPI compatible for frequencies up to 66MHz.

The 34,603,008-bits of memory are organized as 8,192 pages of 512 bytes or 528 bytes each. In addition to the main memory,

the AT45DB321D also contains two SRAM buffers of 512/528 bytes each. These buffers allow the receiving of data while a

page in the main memory is being reprogrammed, as well as the writing of a continuous data stream. EEPROM (electrically

erasable and programmable read-only memory) emulation (bit or byte alterability) is easily handled with a self-contained,

three-step read-modify-write operation. Unlike conventional flash memories, which are accessed randomly with multiple

simple sequential access dramatically reduces active pin count, facilitates hardware layout, increases system reliability,

minimizes switching noise, and reduces package size. The device is optimized for use in many commercial and industrial

applications where high density, low pin count, low voltage and low power are essential.

To allow for simple, in-system reprogrammability, the AT45DB321D does not require high input voltages for programming. The

device operates from a single power supply, 2.7V to 3.6V, for both the program and read operations. The AT45DB321D is

enabled through the chip select pin (CS) and accessed via a three-wire interface consisting of the serial input (SI), serial output

(SO), and serial clock (SCK) lines.

All programming and erase cycles are self timed.

Figure 1-1. Pin configurations and pinouts.

MLF(1) (VDFN)

Top View

Note:

1.

The metal pad on the bottom of

the MLF package is floating.

This pad can be a “No Connect” or

connected to GND.

SOIC

Top View

BGA Package Ball-out

Top View

TSOP: Type 1

Top View

Note:

TSOP package is not recommended for new designs.

Future die shrinks will support 8-pin packages only.

SI

SCK

RESET

CS

SO

GND

VCC

WP

8

7

6

5

1

2

3

4

1

2

3

4

8

7

6

5

SI

SCK

RESET

CS

SO

GND

VCC

WP

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

VCC

GND

SCK

CS

RDY/BSY WP

SI

SO

RESET

1

2

3

4

5

A

B

C

D

E

1

2

3

4

5

6

7

8

9

10

11

12

13

14

28

27

26

25

24

23

22

21

20

19

18

17

16

15

RDY/BUSY

RESET

WP

NC

NC

VCC

GND

NC

NC

NC

CS

SCK

SI

SO

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC