DocID023755 Rev 4

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STC3115

Package information

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8.1

Flip Chip CSP 1.40 x 2.04 mm package information

Figure 15. Flip Chip CSP 1.40 x 2.04 mm package mechanical drawing

1. The terminal A1 on the bump side is identified by a distinguishing feature - for instance, by a circular “clear

area” typically 0.1 mm in diameter and/or a missing bump.

2. The terminal A1, on the back side, is identified by a distinguishing feature - for instance, by a circular “clear

area” typically 0.2 mm in diameter depending on the die size.