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STC3115 数据表(PDF) 28 Page - STMicroelectronics |
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STC3115 数据表(HTML) 28 Page - STMicroelectronics |
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28 / 31 page ![]() Package information STC3115 28/31 DocID023755 Rev 4 Figure 16. Flip Chip CSP 1.4 x 2.04 mm footprint recommendation Table 15. Flip Chip CSP 1.4 x 2.04 mm package mechanical data Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.545 0.600 0.655 0.021 0.024 0.026 A1 0.165 0.200 0.235 0.006 0.008 0.009 A2 0.330 0.350 0.370 0.013 0.014 0.015 b 0.220 0.260 0.300 0.009 0.010 0.012 D 1.98 2.01 2.04 0.078 0.079 0.080 D1 1.20 0.047 E 1.34 1.37 1.40 0.053 0.054 0.055 E1 0.800 0.031 e 0.360 0.400 0.440 0.014 0.016 0.017 fD 0.395 0.405 0.415 0.016 0.016 0.016 fE 0.275 0.285 0.295 0.011 0.011 0.012 G 0.050 0.002 ccc 0.050 0.002 |
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