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LP38853 数据表(PDF) 17 Page - Texas Instruments |
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LP38853 数据表(HTML) 17 Page - Texas Instruments |
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17 / 27 page ![]() LP38853 www.ti.com SNVS335C – DECEMBER 2006 – REVISED SEPTEMBER 2011 Figure 34. Maximum Power Dissipation vs Ambient Temperature for the DDPAK Package Figure 34 shows the maximum allowable power dissipation for DDPAK packages for different ambient temperatures, assuming θJA is 35°C/W and the maximum junction temperature is 125°C. Heat-Sinking The SO PowerPAD-8 Package The LP38853MR package has a θJA rating of 168°C/W, and a θJC rating of 11°C/W. The θJA rating of 168°C/W includes the device DAP soldered to an area of 0.008 square inches (0.09 in x 0.09 in) of 1 ounce copper, with no airflow. Figure 35. θJA vs Copper (1 Ounce) Area for the SO PowerPAD-8 Package Increasing the copper area soldered to the DAP to 1 square inch of 1 ounce copper, using a dog-bone type layout, will improve the θJA rating to 98°C/W. Figure 35 shows that increasing the copper area beyond 1 square inch produces very little improvement. Copyright © 2006–2011, Texas Instruments Incorporated Submit Documentation Feedback 17 Product Folder Links: LP38853 |
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