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LP38853 数据表(PDF) 5 Page - Texas Instruments

部件名 LP38853
功能描述  3A Fast-Response High-Accuracy Adjustable LDO Linear Regulator with Enable and Soft-Start
PDF  27 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

LP38853 数据表(HTML) 5 Page - Texas Instruments

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LP38853
www.ti.com
SNVS335C – DECEMBER 2006 – REVISED SEPTEMBER 2011
Electrical Characteristics (continued)
Unless otherwise specified: VOUT = 0.80V, VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, VEN = VBIAS, IOUT = 10 mA, CIN = COUT = 10 µF,
CBIAS = 1 µF, CSS = open. Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction
temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are specified through test, design, or statistical
correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes
only.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
AC Parameters
VIN = VOUT(NOM) + 1V,
-
80
-
f = 120 Hz
PSRR
Ripple Rejection for VIN Input
(VIN)
Voltage
VIN = VOUT(NOM) + 1V,
-
70
-
f = 1 kHz
dB
VBIAS = VOUT(NOM) + 3V,
-
58
-
f = 120 Hz
PSRR
Ripple Rejection for VBIAS Voltage
(VBIAS)
VBIAS = VOUT(NOM) + 3V,
-
58
-
f = 1 kHz
Output Noise Density
f = 120 Hz
-
1
-
µV/
√Hz
en
BW = 10 Hz
− 100 kHz
-
150
-
Output Noise Voltage
µVRMS
BW = 300 Hz
− 300 kHz
-
90
-
Thermal Parameters
Thermal Shutdown Junction
TSD
-
160
-
Temperature
°C
TSD(HYS)
Thermal Shutdown Hysteresis
-
10
-
TO-220-7
-
60
-
Thermal Resistance, Junction to
θJ-A
DDPAK-7
-
60
-
Ambient(5)
SO PowerPAD-8
-
168
-
°C/W
TO-220-7
-
3
-
Thermal Resistance, Junction to
θJ-C
DDPAK-7
-
3
-
Case(5) (6)
SO PowerPAD-8
-
11
-
(5)
Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to
ambient thermal resistance (
θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not
exceed the maximum operating rating. See the Application Information section for details.
(6)
For TO-220 and DDPAK:
θJ-C refers to the BOTTOM surface of the package, under the epoxy body, as the 'CASE'. For SO PowerPAD-
8:
θJ-C refers to the DAP (aka: Exposed Pad) on BOTTOM surface of the package as the 'CASE'.
Copyright © 2006–2011, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: LP38853



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