Note: All devices operate over the -40ºC to +125ºC tempera-

ture range, unless otherwise noted.

+Denotes a lead(Pb)-free/RoHS-compliant package.

*EP = Exposed pad.

*EP = Exposed pad.

PART

PIN-PACKAGE

MAX17543ATP+

20 TQFN 4mm x 4 mm

PACKAGE

TYPE

PACKAGE

CODE

OUTLINE

NO.

LAND PATTERN

NO.

20 TQFN-EP

T2044+4

21-0139

90-0409

Figure 5 - 3.3V Output, 100kHz Switching Frequency

CF

BST

RT

R8

90.9kΩ

C13

220pF

R5

210kΩ

SYNC

MODE

SGND

RESETB

SS

FB

PGND

PGND

PGND

LX

LX

LX

EN/UVLO

MAX17543

L1

33µH

C5

0.1µF

C6

15pF

R3

97.6kΩ

R7

1kΩ

C4

100µF

R4

36.5kΩ

3.3V, 2.5A

(4.5V to 42V)

C1

2.2µF

C3

33000pF

C4 = C9 = C14 = JMK325ABJ107MM-T

C2

2.2µF

R7 = R3/100

C8

2.2µF

C14

100µF

C9

100µF

C12

47pF

MAX17543

4.5V–42V, 2.5A, High-Efficiency,

Synchronous Step-Down DC-DC Converter

with Internal Compensation

www.maximintegrated.com

Maxim Integrated │ 18

Package Information

For the latest package outline information and land patterns

(footprints), go to

www.maximintegrated.com/packages. Note

that a “+”, “#”, or “-” in the package code indicates RoHS status

only. Package drawings may show a different suffix character, but

the drawing pertains to the package regardless of RoHS status.

Chip Information

PROCESS: BiCMOS

Ordering Information

Typical Application Circuits (continued)