M24C32-R datasheet(34/42 Pages) STMICROELECTRONICS

34 / 42 page

Package mechanical data

M24C32-W M24C32-R M24C32-F M24C32-X M24C32-DF

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DocID4578 Rev 24

Figure 16. UFDFPN8 (MLP8) – package outline (UFDFPN: Ultra thin Fine pitch

Dual Flat Package, No lead)

1. Drawing is not to scale.

2. The central pad (the area E2 by D2 in the above illustration) must be either connected to VSS or left floating

(not connected) in the end application.

Table 21. UFDFPN8 (MLP8) – package dimensions (UFDFPN: Ultra thin Fine pitch

Dual Flat Package, No lead)

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to four decimal digits.

Typ

Min

Max

Typ

Min

Max

0.550

0.450

0.600

0.0217

0.0177

0.0236

0.020

0.000

0.050

0.0008

0.0000

0.0020

0.250

0.200

0.300

0.0098

0.0079

0.0118

2.000

1.900

2.100

0.0787

0.0748

0.0827

D2 (rev MC)

–

1.200

1.600

–

0.0472

0.0630

3.000

2.900

3.100

0.1181

0.1142

0.1220

E2 (rev MC)

–

1.200

1.600

–

0.0472

0.0630

0.500

–

0.0197

–

K (rev MC)

–

0.300

–

0.0118

–

0.300

0.500

–

0.0118

0.0197

–

0.150

–

0.0059

–

0.300

–

0.0118

–

eee(2)

2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

–

0.080

–

0.0031

–

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