ii

CONTENTS

PAGE

1.1 Key Performance Features ................................................................................................................. 2

1.1.1 Memory Space And Addressing Modes ................................................................................... 4

1.1.2 Data Types ............................................................................................................................... 4

1.1.3 Large Register Set ................................................................................................................... 4

1.1.4 Multiple Register Sets .............................................................................................................. 5

1.1.5 Instruction Cache ..................................................................................................................... 6

1.1.6 Register Scoreboarding ........................................................................................................... 6

1.1.7 High Bandwidth Bus ................................................................................................................ 6

1.1.8 Interrupt Handling .................................................................................................................... 6

1.1.9 Debug Features ....................................................................................................................... 6

1.1.10 Fault Detection ....................................................................................................................... 7

1.1.11 Built-in Testability .................................................................................................................... 7

1.1.12 CHMOS .................................................................................................................................. 7

2.0 ELECTRICAL SPECIFICATIONS............................................................................................................. 11

2.1 Power and Grounding ....................................................................................................................... 11

2.2 Power Decoupling Recommendations .............................................................................................. 11

2.3 Connection Recommendations ......................................................................................................... 11

2.4 Characteristic Curves ....................................................................................................................... 11

2.5 Test Load Circuit ............................................................................................................................... 13

2.6 ABSOLUTE MAXIMUM RATINGS* .................................................................................................. 14

2.7 DC Characteristics ............................................................................................................................ 14

2.8 AC Specifications .............................................................................................................................. 15

3.0 MECHANICAL DATA................................................................................................................................ 21

3.1 Packaging ......................................................................................................................................... 21

3.2 Pin Assignment ................................................................................................................................. 21

3.3 Pinout ................................................................................................................................................ 23

3.4 Package Thermal Specifications ...................................................................................................... 27

3.5 Stepping Register Information .......................................................................................................... 27

4.0 WAVEFORMS ........................................................................................................................................... 28

5.0 REVISION HISTORY ................................................................................................................................ 34

80960SA

EMBEDDED 32-BIT MICROPROCESSOR

WITH 16-BIT BURST DATA BUS