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TOP264VG 数据表(PDF) 20 Page - Power Integrations, Inc. |
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TOP264VG 数据表(HTML) 20 Page - Power Integrations, Inc. |
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20 / 40 page ![]() Rev. E 08/12 20 TOP264-271 www.powerint.com mode. As can be seen in Figures 27 and 28, the benefits of jitter increase with the order of the switching harmonic due to an increase in frequency deviation. The FREQUENCY pin offers a switching frequency option of 132 kHz or 66 kHz. In applications that require heavy snubber on the drain node for reducing high frequency radiated noise (for example, video noise sensitive applications such as VCRs, DVDs, monitors, TVs, etc.), operating at 66 kHz will reduce snubber loss, resulting in better efficiency. Also, in applications where transformer size is not a concern, use of the 66 kHz option will provide lower EMI and higher efficiency. Note that the second harmonic of 66 kHz is still below 150 kHz, above which the conducted EMI specifications get much tighter. For 10 W or below, it is possible to use a simple inductor in place of a more costly AC input common mode choke to meet worldwide conducted EMI limits. Transformer Design It is recommended that the transformer be designed for maximum operating flux density of 3000 Gauss and a peak flux density of 4200 Gauss at maximum current limit. The turns ratio should be chosen for a reflected voltage (V OR) no greater than 135 V when using a Zener clamp or 150 V (max) when using an RCD clamp with current limit reduction with line voltage (overload protection). For designs where operating current is significantly lower than the default current limit, it is recommended to use an externally set current limit close to the operating peak current to reduce peak flux density and peak power (see Figure 18). Standby Consumption Frequency reduction can significantly reduce power loss at light or no-load, especially when a Zener clamp is used. For very low secondary power consumption, use a TL431 regulator for feedback control. A typical TOP264-271 circuit automatically enters MCM mode at no-load and the low frequency mode at light load, which results in extremely low losses under no-load or standby conditions. High Power Designs The TOP264-271 family contains parts that can deliver up to 162 W. High power designs need special considerations. Guidance for high power designs can be found in the Design Guide for TOP264-271 (AN-47). TOP264-271 Layout Considerations The TOP264-271 has multiple pins and may operate at high power levels. The following guidelines should be carefully followed. Primary Side Connections Use a single point (Kelvin) connection at the negative terminal of the input filter capacitor for the SOURCE pin and bias winding return. This improves surge capabilities by returning surge currents from the bias winding directly to the input filter capacitor. The CONTROL pin bypass capacitor should be located as close as possible to the SOURCE and CONTROL pins, and its SOURCE connection trace should not be shared by the main MOSFET switching currents. All SOURCE pin referenced components connected to the VOLTAGE MONITOR (V) pin or EXTERNAL CURRENT LIMIT (X) pin should also be located closely between their respective pin and SOURCE. Once again, the SOURCE connection trace of these components should not be shared by the main MOSFET switching currents. It is very critical that SOURCE pin switching currents are returned to the input capacitor negative terminal through a separate trace that is not shared by the components connected to CONTROL, VOLTAGE MONITOR or EXTERNAL CURRENT LIMIT pins. This is because the SOURCE pin is also the controller ground reference pin. Any traces to the VOLTAGE MONITOR, EXTERNAL CURRENT LIMIT or CONTROL pins should be kept as short as possible and away from the DRAIN trace to prevent noise coupling. Voltage monitor resistors (R LS in Figures 14, 15, 19, 22, 23, 26, 30) and primary-side OVP circuit components V ZOV/ROV in Figures (29, 30) should be located close to the VOLTAGE MONITOR pin to minimize the trace length on the VOLTAGE MONITOR pin side. Resistors connected to the VOLTAGE MONITOR or EXTERNAL CURRENT LIMIT pin should be connected as close to the bulk capacitor positive terminal as possible while routing these connections away from the power switching circuitry. In addition to the 47 mF CONTROL pin Figure 28. TOPSwitch-JX Full Range EMI Scan (132 kHz with Jitter) with Identical Circuitry and Conditions. -20 -10 0 -10 20 30 40 50 60 70 80 0.15 1 10 30 Frequency (MHz) EN55022B (QP) EN55022B (AV) EN55022B (QP) EN55022B (AV) -20 -10 0 -10 20 30 40 50 60 70 80 0.15 1 10 30 Frequency (MHz) TOPSwitch-JX (with jitter) Figure 27. Fixed Frequency Operation without Jitter. |
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