数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

TOP264VG 数据表(PDF) 24 Page - Power Integrations, Inc.

部件名 TOP264VG
功能描述  Integrated Off-Line Switcher with EcoSmart Technology for Highly Efficient Power Supplies
PDF  40 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  POWERINT [Power Integrations, Inc.]
网页  http://www.powerint.com
标志 POWERINT - Power Integrations, Inc.

TOP264VG 数据表(HTML) 24 Page - Power Integrations, Inc.

Back Button TOP264VG Datasheet HTML 20Page - Power Integrations, Inc. TOP264VG Datasheet HTML 21Page - Power Integrations, Inc. TOP264VG Datasheet HTML 22Page - Power Integrations, Inc. TOP264VG Datasheet HTML 23Page - Power Integrations, Inc. TOP264VG Datasheet HTML 24Page - Power Integrations, Inc. TOP264VG Datasheet HTML 25Page - Power Integrations, Inc. TOP264VG Datasheet HTML 26Page - Power Integrations, Inc. TOP264VG Datasheet HTML 27Page - Power Integrations, Inc. TOP264VG Datasheet HTML 28Page - Power Integrations, Inc. Next Button
Zoom Inzoom in Zoom Outzoom out
 24 / 40 page
background image
Rev. E 08/12
24
TOP264-271
www.powerint.com
Absolute Maximum Ratings(2)
DRAIN Pin Peak Voltage ..................................... -0.3 V to 725 V
DRAIN Pin Peak Current: TOP264................................... 2.08 A
DRAIN Pin Peak Current: TOP265................................... 2.72 A
DRAIN Pin Peak Current: TOP266................................... 4.08 A
DRAIN Pin Peak Current: TOP267................................... 5.44 A
DRAIN Pin Peak Current: TOP268................................... 6.88 A
DRAIN Pin Peak Current: TOP269................................... 7.73 A
DRAIN Pin Peak Current: TOP270................................... 9.00 A
DRAIN Pin Peak Current: TOP271................................. 11.10 A
CONTROL Pin Voltage............................................ -0.3 V to 9 V
CONTROL Pin Current .................................................. 100 mA
VOLTAGE MONITOR Pin Voltage ........................... -0.3 V to 9 V
CURRENT LIMIT Pin Voltage .............................. -0.3 V to 4.5 V
FREQUENCY Pin Voltage ......................................-0.3 V to 9 V
Storage Temperature ...................................... -65
°C to 150 °C
Operating Junction Temperature......................-40 °C to 150 °C
Lead Temperature(1) ........................................................260 °C
Notes:
1. 1/16 in. from case for 5 seconds.
2. Maximum ratings specified may be applied one at a time
without causing permanent damage to the product. Expo
sure to Absolute Maximum Rating conditions for extended
periods of time may affect product reliability.
Thermal Resistance
Parameter
Symbol
Conditions
SOURCE = 0 V; T
J = -40 to 125 °C
See Figure 35
(Unless Otherwise Specified)
Min
Typ
Max
Units
Control Functions
Switching Frequency
in Full Frequency
Mode (average)
f
OSC
T
J = 25 °C
FREQUENCY Pin
Connected to SOURCE
119
132
145
kHz
FREQUENCY Pin
Connected to CONTROL
59.4
66
72.6
Frequency Jitter
Deviation
Df
132 kHz Operation
±5
kHz
66 kHz Operation
±2.5
Frequency Jitter
Modulation Rate
f
M
250
Hz
Maximum Duty Cycle
DC
MAX
I
C = ICD1
I
V ≤ IV(DC)
V
V = 0 V
75
78
83
%
I
V = 95 mA
30
Soft-Start Time
t
SOFT
T
J = 25 °C
17
ms
PWM Gain
DC
REG
T
J = 25 °C
I
B < IC < IC01
See Note C
TOP264-265
-62
-50
-40
%/mA
TOP266-268
-54
-44
-34
TOP269-271
-50
-40
-30
T
J = 25 °C
I
C ≥ IC01
See Note A
TOP264-265
-61
-51
-41
TOP266-268
-60
-50
-40
TOP269-271
-57
-48
-38
PWM Gain
Temperature Drift
See Note B
-0.01
%/mA/°C
External Bias Current
I
B
66 kHz Operation
TOP264-265
0.8
1.4
2.0
mA
TOP266-268
0.9
1.5
2.1
TOP269-271
1.0
1.6
2.2
Thermal Resistance: E Package
(
q
JA) .......................................... 105 °C/W
(1)
(
q
JC) .............................................. 2 °C/W
(2)
V Package
(
q
JA) .......................... .68 °C/W
(3)
, 58 °C/W(4)
(
q
JC) .............................................. 2 °C/W
(2)
K Package
(
q
JA) ...........................45 °C/W
(3)
, 38 °C/W(4)
(
q
JC) .............................................. 2 °C/W
(2)
Notes:
1. Free standing with no heat sink.
2. Measured at the back surface of tab.
3. Soldered (including exposed pad for K package) to typical
application PCB with a heat sinking area of 0.36 sq. in. (232mm2),
2 oz. (610 g/m2) copper clad.
4. Soldered (including exposed pad for K package) to typical
application PCB with a heat sinking area of 1 sq. in. (645 mm2),
2 oz. (610 g/m2) copper clad.



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com