4-8

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FSGS230R

TO-257AA

3 LEAD JEDEC TO-257AA HERMETIC METAL PACKAGE

Q

D

L

Ø

b

e

E

A

0.065 R TYP.

ØP

Ø

12

3

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.190

0.200

4.83

5.08

-

0.035

0.045

0.89

1.14

-

Øb

0.025

0.035

0.64

0.88

2, 3

0.060

0.090

1.53

2.28

-

D

0.645

0.665

16.39

16.89

-

E

0.410

0.420

10.42

10.66

-

e

0.100 TYP

2.54 TYP

4

0.200 BSC

5.08 BSC

4

0.230

0.250

5.85

6.35

-

0.110

0.130

2.80

3.30

4

L

0.600

0.650

15.24

16.51

-

-

0.035

-

0.88

-

ØP

0.140

0.150

3.56

3.81

-

Q

0.113

0.133

2.88

3.37

-

NOTES:

1. These dimensions are within allowable dimensions of Rev. B of

JEDEC TO-257AA dated 9-88.

2. Add typically 0.002 inches (0.05mm) for solder coating.

3. Lead dimension (without solder).

4. Position of lead to be measured 0.150 inches (3.81mm) from bottom

of dimension D.

5. Die to base BeO isolated, terminals to case ceramic isolated.

6. Controlling dimension: Inch.

7. Revision 1 dated 1-93.

WARNING!

BERYLLIA WARNING PER MIL-S-19500

Packages containing beryllium oxide (BeO) shall not be ground, machined, sandblasted, or subject to any mechanical operation

which will produce dust containing any beryllium compound. Packages containing any beryllium compound shall not be

subjected to any chemical process (etching, etc.) which will produce fumes containing beryllium or its’ compounds.