Data Sheet

AD8351

Rev. D | Page 19 of 19

OUTLINE DIMENSIONS

Figure 51. 10-Lead Mini Small Outline Package [MSOP]

(RM-10)

Dimensions shown in millimeters

Figure 52. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

3 mm × 3 mm Body, Very Very Thin Quad

(CP-16-35)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

Branding

AD8351ARM

−40°C to +85°C

10-Lead Mini Small Outline Package [MSOP]

RM-10

JDA

AD8351ARM-REEL7

−40°C to +85°C

10-Lead Mini Small Outline Package [MSOP]

RM-10

JDA

AD8351ARMZ

−40°C to +85°C

10-Lead Mini Small Outline Package [MSOP]

RM-10

#JDA

AD8351ARMZ-REEL7

−40°C to +85°C

10-Lead Mini Small Outline Package [MSOP]

RM-10

#JDA

AD8351ACPZ-R7

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-16-35

Q20

AD8351-EVALZ

Evaluation Board

COMPLIANT TO JEDEC STANDARDS MO-187-BA

6°

0°

0.70

0.55

0.40

5

10

1

6

0.50 BSC

0.30

0.15

1.10 MAX

3.10

3.00

2.90

COPLANARITY

0.10

0.23

0.13

3.10

3.00

2.90

5.15

4.90

4.65

PIN 1

IDENTIFIER

15° MAX

0.95

0.85

0.75

0.15

0.05

3.10

3.00 SQ

2.90

0.32

0.25

0.20

1.80

1.70 SQ

1.60

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

EXPOSED

PAD

PIN 1

INDICATOR

(0.30)

0.50

0.40

0.30

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

0.20 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

©2003–2015 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D03145-0-1/15(D)